Transient and impact dynamics of a micro-accelerometer

Journal of Materials Processing and Manufacturing Science

Volumn 9, Issue 2, 2000, Pages 143-155

  Li, G ^a   Tseng, A A ^b  

^a OMM Inc   (United States)

^b Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COMPUTER SIMULATION; DAMPING; DEGREES OF FREEDOM (MECHANICS); FINITE ELEMENT METHOD; IMPACT TESTING; MICROMACHINING; OSCILLATORS (MECHANICAL); SCANNING ELECTRON MICROSCOPY; STRESS ANALYSIS; THERMAL EXPANSION; TRANSDUCERS;

IMPACT DYNAMICS;

ACCELEROMETERS;

EID: 0034289113     PISSN: 10620656     EISSN: None     Source Type: Journal    
DOI: 10.1106/LD5T-3YLT-23WP-PTJ3     Document Type: Article

References (7)

1. Design of sealed cavity microstructures formed by silicon wafer bonding
2. Low stress packaging of a micro-machined accelerometer
3. Silicon as a mechanical material
4. Surface Micromachined Polysilicon Accelerometer Technical Digest
5. A two-chip accelerometer system for automotive applications