Performance evaluation and analysis of a novel 300-mm combination bake-chill station

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5039 II, Issue , 2003, Pages 1433-1443

  Narasimhan, Arunn ^a   Ramanan, Natarajan ^a   Williams, Daniel J ^a  

^a Microlithography Division   (United States)

Author keywords

300 mm resist processing; Bake plate; Chemically amplified resist; Chill plate; Combination bake chill; Numerical simulation; Proximity bake; Thermal analysis; Throughput

Indexed keywords

COMPUTER SIMULATION; FINITE VOLUME METHOD; HEAT TRANSFER; MATHEMATICAL MODELS; PERFORMANCE; SEMICONDUCTOR DEVICE MANUFACTURE; TEMPERATURE CONTROL; TEMPERATURE MEASUREMENT; THERMOANALYSIS; THREE TERM CONTROL SYSTEMS;

BAKE PLATE; CHEMICALLY AMPLIFIED RESIST; CHILL PLATE; COMBINATION BAKE CHILL; PROXIMITY BAKE;

PHOTORESISTS;

EID: 0141499093     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.485199     Document Type: Conference Paper

References (7)

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