On the behaviour of the selective iodine-based gold etch for the failure analysis of aged optoelectronic devices

Microelectronics Reliability

Volumn 43, Issue 9-11, 2003, Pages 1771-1776

  Mura, G ^a   Vanzi, M ^a   Stangoni, M ^b   Ciappa, M ^b   Fichtner, W ^b  

^a UNIVERSITY OF CAGLIARI   (Italy)

^b ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; ETCHING; FAILURE ANALYSIS; GOLD; METALLIZING;

ELECTRONIC COMPONENTS;

OPTOELECTRONIC DEVICES;

EID: 0043195440     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00298-1     Document Type: Article

References (2)

1. M. Vanzi et al. Gold Removal in Failure Analysis of GaAs-based Laser Diodes Micr. Reliab. 39(1999)1043
2. F. Bigoli et al. A powerful new oxidation agent toward gold powder: N,N'-dimethyperhydrodiazepine-2,3-dithione(D) bis(diiodiue),Synthesis and X-ray structureof [AuDI2]I3 Chem. Comm. (1998)2351