Auger electron spectroscopy study of interdiffusion, oxidation and segregation during thermal treatment of NiCr/CuNi(Mn)/NiCr thin films

Applied Surface Science

Volumn 144-145, Issue , 1999, Pages 216-221

  Baunack, S ^a   Bruckner W ^a   Pitschke, W ^a   Thomas, J ^a  

^a IFW DRESDEN   (Germany)

Author keywords

AES; Factor analysis; Interdiffusion; Oxidation; Segregation; Thin film

Indexed keywords

ANNEALING; AUGER ELECTRON SPECTROSCOPY; COPPER COMPOUNDS; DIFFUSION; INTERFACES (MATERIALS); ION BOMBARDMENT; LEAST SQUARES APPROXIMATIONS; NICKEL COMPOUNDS; OXIDATION; SEGREGATION (METALLOGRAPHY); SPUTTER DEPOSITION; TEMPERATURE;

AUGER ELECTRON DEPTH PROFILING; INTERDIFFUSION; LINEAR LEAST SQUARES; PRINCIPAL COMPONENT ANALYSIS; TARGET FACTOR ANALYSIS;

THIN FILMS;

EID: 0043054141     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(98)00800-9     Document Type: Article

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