Thickness Alteration of Grain-Boundary Amorphous Films during Creep of a Multiphase Silicon Nitride Ceramic

Journal of the American Ceramic Society

Volumn 84, Issue 6, 2001, Pages 1296-1300

  Jin, Qiang ^a,c   Wilkinson, David S ^a   Weatherly, George C ^a   Luecke, William E ^b   Wiederhorn, Sheldon M ^b  

^a MCMASTER UNIVERSITY   (Canada)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^c EXXONMOBIL UPSTREAM RESEARCH COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS FILMS; CREEP; GRAIN BOUNDARIES; HIGH TEMPERATURE EFFECTS; MICROSTRUCTURE; SILICON NITRIDE; STATISTICAL METHODS; TRANSMISSION ELECTRON MICROSCOPY;

MULTIPHASE MICROSTRUCTURE;

CERAMIC MATERIALS;

EID: 0043023383     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2001.tb00832.x     Document Type: Article

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