Reliable use of commercial technology in high temperature environments

Microelectronics Reliability

Volumn 40, Issue 8-10, 2000, Pages 1671-1678

  McCluskey, Patrick ^a   Mensah, Kofi ^a   O'Connor, Casey ^a   Gallo, Anthony ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b Materials Olean Dexter Electronic   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042512019     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00188-8     Document Type: Article

References (8)

1. Pecht, M., Nguyen, L., Hakim, E. Plastic-Encapsulated Microelectronics, John W. Wiley & Sons, Inc., New York, NY (1995).
2. Bates, B. "Molding Compounds Technology for Military Applications," Commercial and Plastic Components in Military Applications Workshop, Indianapolis, IN (1993).
3. Khan, M., Fatemi, H., Romero, J., Delenia, E. "Effect of High Thermal Stability Mold Material on the Gold-Aluminum Bond Reliability in Epoxy Encapsulated VLSI Devices," IEEE International Reliability Physics Symposium (1988) pp. 40-49.
4. Kidson, G. "Some Aspects of the Growth of Diffusion Layers in Binary Systems," Journal of Nuclear Materials, 3, No. 1 (1961) pp. 21-29.
5. McCluskey, P., Das, D., Jordan, J., Grzybowski, R., Fink, J., Condra, Lloyd, Torri, T. "Packaging of Electronics for High Temperature Applications," The International Journal of Microcircuits and Electronic Packaging, Vol. 20, No. 3 (1997) pp. 409-423.
6. Philofsky, E. "Design Limits When Using Gold-Aluminum Bonds," Ninth Annual Proceedings of the International Reliability Physics Symposium, Las Vegas, NV (1971) pp. 11-16.
7. Philofsky, E. "Purple Plague Revisited," Eighth Annual Proceedings of the International Reliability Physics Symposium, Las Vegas, NV (1970) pp. 177-185.
8. Mulgaonker, S., Hawkins, G., Ramakrishna, K., Mawer, A. and Winkler, E., "PGA for High Power: Extending the Thermal Envelope," Proceedings of the 1996 IEEE Electronic Components and Technology Conference, (1996) p. 713.