DEVELOPMENT OF NEW COPPER BALL-BONDING WIRE.

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1988, Pages 539-545

  Mori, Satoru ^a   Yoshida, Hideaki ^a   Uchiyama, Naoki ^a  

^a MITSUBISHI MATERIALS CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER AND ALLOYS; INTEGRATED CIRCUIT MANUFACTURE; SEMICONDUCTOR DEVICE MANUFACTURE;

BALL-BONDING WIRE; BALL-NECK STRENGTH; HIGH-LEAD-COUNT; LONG LOOP; LOOP BEND;

ELECTRIC CONDUCTORS, WIRE;

EID: 0023779623     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)