COPPER WIRE BALL BONDING.

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1984, Pages 1-6

  Kurtz, John ^a   Cousens, Donald ^a   Dufour, Mark ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM BONDING PADS; CONTACT RESISTANCE; COPPER BALL SIZE FORMATION; COPPER WIRE DIAMETER; IC CHIPS; SILVER PLATED LEAD FRAME FINGERS;

ELECTRIC CONDUCTORS, WIRE;

EID: 0021124594     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)