Development of a non-toxic electrolyte for soft gold electrodeposition: An overview of work at University of Newcastle upon Tyne

Green Chemistry

Volumn 5, Issue 4, 2003, Pages 376-381

  Liew, M J ^a   Roy, S ^a   Scott, K ^a  

^a NEWCASTLE UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CYANIDE; ELECTROLYTE; GOLD; LIGAND; SULFITE; THIOSULFATE;

CHEMICAL PARAMETERS; DEVICE; ELECTRIC CONDUCTIVITY; ELECTRONICS; ELECTROPLATING INDUSTRY; HARDNESS; METHODOLOGY; PHYSICAL CHEMISTRY; PROCESSING; RECYCLING; REVIEW; SAFETY; STORAGE; TOXICITY; UNIVERSITY; WASTE DISPOSAL;

EID: 0042381333     PISSN: 14639262     EISSN: None     Source Type: Journal    
DOI: 10.1039/b301176n     Document Type: Review

References (36)

1. H. Watanabe, S. Hayashi and H. Honma, Microbump Formation by Noncyanide Gold Electroplating, J. Electrochem. Soc., 1999, 146(2), 574.
2. A. Gemmler, W. Keller, H. Ritcher and K. Ruess, High-Performance Gold Plating for Microdevices, Plat. Surf. Finish., 1994, 81, 52.
3. J. Traut, J. Wright and J. Williams, Gold Plating Optimization for Tape Automated Bonding, Plat. Surf. Finish., 1990, 77(9), 49.
4. J. Jasper and D. Shiels, Gold Bumps off the Danger List, European Semiconductor, 2000, 22(7), 86.
5. Y. Okinaka and M. Hoshino, Some Recent Topics in Gold Plating for Electronics Applications, Gold Bull., 1998, 31(1), 3.
6. I. R. Christie and B. P. Cameron, Gold Electrodeposition Within the Electronics Industry, Gold Bull., 1994, 27(1), 12.
7. W. J. Daukler, D. J. Resnick, W. A. Johnson and A. W. Yanof, New Operating Regime for Electroplating the Gold Absorber on X-ray Masks, Microelectron. Eng., 1994, 23, 235.
8. W. Chu, M. L. Schattenburg and H. I. Smith, Low-Stress Gold Electroplating for X-ray Masks, Microelectron. Eng., 1992, 17, 223.
9. A. Maner, S. Harsch and W. Ehrfeld, Mass-Production of Micro-devices with Extreme Aspect Ratios by Electroforming, Plat. Surf. Finish., 1998, 75, 60.
10. K. Kosaki, M. Matsuoka, Y. Seiwa, S. Orisaka, K. Nishitani and M. Otsubo Stabilization of Gold Sulfite Bath for Microscale Plating in GaAs ICs, Proceedings of the First Symposium on Electrochemical Microfabrication, Eds. M. Datta, K. Sheppard and D. Synder, PV 92-93, pp. 317, The Electrochemical Society Proceedings Series, Pennington, NJ 1992.
11. Y. Okinaka, Significance of Inclusions in Electroplated Gold Films for Electronics Applications, Gold. Bull., 2000, 33(4), 117.
12. W. Sun and D. G. Ivey, Development of an Electroplating Solution for Codepositing Au-Sn Alloys, Materials Science and Engineering, 1999, B65, 111.
13. Y. Okinaka and S. Nakahara, Structure of Electroplated Hard Gold Observed by Transmission Electron Microscopy, J. Electrochem. Soc., 1976, 123(9), 1284.
14. T. E. Dinan and H. Y. Cheh, The Effect of Arsenic upon the Hardness of Electrodeposited Gold, J. Electrochem. Soc., 1992, 139(2), 410.
15. H. Y. Cheh and R. Sard, Electrochemical and Structural Aspects of Gold Electrodeposition from Dilute Solutions by Direct Current, J. Electrochem. Soc., 1971, 118(11), 1737.
16. L. T. Romankiw and E. J. M. O'Sullivan Handbook of Microlithography, Micromachining and Microfabrication, Vol. 2, Ed. P. Rai-Choudhury, pp. 197, SPIE Press, Bellingham 1997.
17. P. Wilkinson, Understanding Gold Plating, Gold Bull., 1986, 19(3), 75.
18. D. R. Gabe, Use of Cyanides in Surface Finishing: Environmental Considerations, Trans. Inst. Met. Fin., 1997, 75, B131.
19. D. R. Turner, Proceedings of Symposium on Electrodeposition Technology, Theory and Practice, Eds. L. T. Romankiw and D. R. Turner, PV 87-17, pp. 417, The Electrochemical Society Proceedings Series, Pennington, NJ 1987.
20. H. Honma and K. Hagiwara, Fabrication of Gold Bumps Using Gold Sulfite Plaing, J. Electrochem. Soc., 1995, 142(1), 81.
21. R. J. Morrisey, A Versatile Non-cyanide Gold Plating System, Plat. Surf. Finish., 1993, 80, 75.
22. J. Simon, Development of High Speed Gold Bumping Process Using a Sulfite Electrolyte, Proceedings of the 9th Microelectronics Conf. Tokyo, Japan, 1996, 265.
23. J. Horkans and T. Romankiw, Pulsed Potentiostatic Deposition of Gold from Solutions of the Au (I) Sulfite Complex, J. Electrochem. Soc., 1977, 124(10), 1499.
24. D. Mason, Time for Gold Sulfite: Part 2, Plat. Surf. Finish., 1986, 73(5), 20.
25. H. Honma and Y. Kagaya, Gold Plating Using Disulfiteaurate Complex, J. Electrochem. Soc., 1993, 140(9), L135.
26. J. Simon, W. Zilske and F. Simon, Development of a High Speed Gold Sulfite Electrolyte for Bumping, Proceedings 1995 International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium, 1995, 275.
27. W. S. Rapson and T. Groenewald, Gold Usage, Academic Press, Inc., New York 1978.
28. A. M. Sullivan and P. A. Kohl, Electrochemical Study of the Gold Thiosulfate Reduction, J. Electrochem. Soc., 1997, 144(5), 1686.
29. X. Wang, N. Issaev and J. G. Osteryoung, A Novel Gold Electroplating System: Gold (I)-Iodide-Thiosulfate, J. Electrochem. Soc., 1998, 145(3), 974.
30. th IEEE Electronic Components Technology Conference, 1999, 1059.
31. th IEEE Intl. Electronic Manufacturing Tech. Symp., 1997, 220.
32. T. Osaka, A. Kodera, T. Misato, T. Homma and Y. Okinaka, Electrodeposition of Soft Gold from a Thiosulfate-Sulfite Bath for Electronics Applications, J. Electrochem. Soc., 1997, 144(10), 3462.
33. th Ed., John Wiley & Sons, Inc., USA 2000.
34. D. W. Endicott, H. K. James and F. Nobel, Effects of Additives in Gold Deposits on Semiconductor Wire Bonding, Plat. Surf. Finish., 1981, 69(8), 58.
35. M. J. Liew, Novel Gold Electrodeposition Process for Micro and Opto Electronics, PhD Thesis, University of Newcastle upon Tyne, 2002.
36. T. A. Green, S. Roy and M. J. Liew, Electrodeposition of Gold from a Thiosulfate-Sulfite Bath for Microelectronic and Optoelectronic Applications, J. Electrochem. Soc., 2003, in press.