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Volumn 22, Issue 7, 2000, Pages
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Gold bumps off the danger list
a
a
NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
CONDUCTIVE FILMS;
ELECTRONICS PACKAGING;
FLIP CHIP DEVICES;
GOLD;
INTERCONNECTION NETWORKS;
LIQUID CRYSTAL DISPLAYS;
MICROPROCESSOR CHIPS;
PERSONAL COMPUTERS;
PRINTED CIRCUIT BOARDS;
SOLDERING ALLOYS;
ACTIVE MATRIX LIGHT EMITTING DIODES (AM-LED);
ANISOTROPIC-CONDUCTIVE FILMS (ACF);
SOLDER BUMPS;
TAPE AUTOMATED BONDING (TAB);
TAPE CARRIER PACKAGES (TCP);
INTEGRATED CIRCUIT LAYOUT;
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EID: 0012646858
PISSN: 02656027
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (10)
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References (0)
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