Variation of etch profile and surface properties during patterning of silicon substrates

Surface and Coatings Technology

Volumn 142-144, Issue , 2001, Pages 797-802

  Richter, K ^a   Orfert, M ^a   Schuhrer H ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Etching; Patterned silicon; Surface properties

Indexed keywords

ANISOTROPY; CONTOUR MEASUREMENT; FLUIDIC DEVICES; PASSIVATION; PLASMA ETCHING; SILICON; SUBSTRATES; SURFACE ROUGHNESS; SURFACE TREATMENT;

PATTERNED SILICON SUBSTRATES;

COMPOSITE MICROMECHANICS;

ETCHING;

EID: 0035386113     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(01)01185-9     Document Type: Article

References (7)