A new indentation cracking method for evaluating interfacial adhesion energy of hard films

Thin Solid Films

Volumn 441, Issue 1-2, 2003, Pages 172-179

  Kim, Jong Jin ^a   Jeong, Jeung Hyun ^a   Lee, Kwang Ryeol ^b   Kwon, Dongil ^a  

^a Seoul National University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

Author keywords

Adhesion; Critical energy release rate; Diamond like carbon; dP dc; Indentation cracking test; Strain continuity

Indexed keywords

ADHESION; CRACK INITIATION; INDENTATION; INTERFACES (MATERIALS); STRAIN; STRESSES;

HARD FILMS;

DIAMOND LIKE CARBON FILMS;

EID: 0042009131     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)00920-9     Document Type: Article

References (18)

1. Thornton J.A., Hoffman D.W. Thin Solid Films. 171:1989;5.
2. Hoffman R.W. Mater. Sci. Eng. 53:1982;37.
3. Mittal K.L. Electrocomp. Sci. Technol. 3:1976;21.
4. Pulker H.K., Perry A.J., Berger R. Surf. Technol. 14:1981;25.
5. Steinmann P.A., Hintermann H.E. J. Vac. Sci. Technol. A7:(3):1989;2267.
6. Chalker P.R., Bull S.J., Rickerby D.S. Mater. Sci. Eng. A140:1991;583.
7. Drory M.D., Hutchinson J.W. Proc. R. Soc. Lond. A452:1996;2319.
8. Nesládek M., Vandierendonck K., Quaeyhaegens C., Kerkhofs M., Stals L.M. Thin Solid Films. 270:1995;184.
9. McCune R.C., Chase R.E., Cartwright E.L. Surf. Coat. Technol. 53:1992;189.
10. Mallika K., Komanduri R. Wear. 224:1999;245.
11. Jindal P.C., Quinto D.T., Wolfe G.J. Thin Solid Films. 154:1987;361.
12. Chiang S.S., Marshall D.B., Evans A.G. Materials science research. Pask J.A., Evans A.G. Surfaces and Interfaces in Ceramic and Ceramic-Metal Systems. 14:1981;603 Plenum, New York.
13. Hill R. The Mathematical Theory of Plasticity. 1950;97 Clarendon, Oxford.
14. Ahn J.-H., Kwon D. J. Appl. Phys. 82:(7):1997;3266.
15. Lee K.-R., Baik Y.-J., Eun K., Han S. Diamond Relat. Mater. 3:1994;1230.
16. Tsui T.Y., Pharr G.M. J. Mater. Res. 14:1999;292.
17. Yan P., Song Q. Mater. Chem. Phys. 58:1999;195.
18. Lee K.-R., Eun K.Y., Kim I., Kim J. Thin Solid Films. 377-378:2000;261.