Developing and implementing an advanced CMP run-to-run controller

MICRO

Volumn 21, Issue 7, 2003, Pages 45-52

  Toprac, Anthony J ^a   Luna, Hector ^b   Withers, Brad ^b   Bedrin, Mark ^b   Toy, Stephen ^b  

^a APC Devmt Center of Yield Dynamics   (United States)

^b NEC Corporation of America   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL INDUSTRY; CONTROL EQUIPMENT; SURFACE ROUGHNESS;

POLISH SIMULATORS;

CHEMICAL MECHANICAL POLISHING;

EID: 0041762529     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. SR Runnels, I Kim, and F Miceli, "Implementing Large Area 3D Erosion Simulation," in Proceedings of the 1999 Chemical-Mechanical Planarization for Multilevel Interconnect Conference (Tampa, FL: IMIC, 1999), 128-135.
2. T Laursen et al., "Modeling of Feature-Scale Planarization in Cu CMP Using Mesa," in Proceedings of the 1999 Advanced Metallization Conference (Warrendale, PA: Materials Research Society, 2000), 677-681.
3. T Laursen, SR Runnels, and AJ Toprac, "Application of Mesa Modeling for Chemical Mechanical Polishing," in Proceedings of the 2000 Advanced Metallization Conference (Warrendale, PA: Materials Research Society 2000), 205-209.
4. AJ Toprac, "Model-Based Control of Chemical Mechanical Polishing," in Proceedings of SPIE, vol. 3213, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III (Bellingham, WA: SPIE, 1997), 101-107.
5. FW Preston, "The Theory and Design of Plate Glass Polishing Machine," Journal of Glass Technology 11, no. 44 (1927): 214-256.