SCOPUS 정보 검색 플랫폼

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3213, Issue , 1997, Pages 101-107

Model-based control of Chemical Mechanical Polishing

(1) Toprac, Anthony J a

a ADVANCED MICRO DEVICES (United States)

Author keywords

Chemical mechanical planarization; CMP; Model predictive control; Run to run control

Indexed keywords

CHEMICAL MECHANICAL PLANARIZATION; CMP; CMP TOOLS; CONTROL ALGORITHMS; CONTROL MODELS; MODEL-BASED; PLANARIZATION; POLISHING PADS; POLISHING TIMES; REMOVAL RATES; RUN-TO-RUN CONTROL; SILICON OXIDES; SILICON WAFER SURFACES; THEORETICAL MODELS; TIME VARIATIONS;

CHEMICAL EQUIPMENT; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; CONTROL THEORY; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; MECHANICAL CONTROL EQUIPMENT; METAL RECOVERY; MODEL PREDICTIVE CONTROL; NANOTECHNOLOGY; POLISHING; PREDICTIVE CONTROL SYSTEMS; ROBUST CONTROL; SEMICONDUCTING SILICON COMPOUNDS; SILICA; SILICON COMPOUNDS; SILICON WAFERS;

PROCESS CONTROL;

EID: 57649198949 PISSN: 0277786X EISSN: None Source Type: Conference Proceeding
DOI: 10.1117/12.284626 Document Type: Conference Paper

Times cited : (2)

References (8)

1
- 0028465918
- Feature-Scale Fluid-based Erosion Modeling for Chemical-Mechanical Polishing
- S.R. Runnels, "Feature-Scale Fluid-based Erosion Modeling for Chemical-Mechanical Polishing", J. Electrochem. Soc, 141 (7), pp. 1900-1904 (1994).
- (1994) J. Electrochem. Soc , vol.141 , Issue.7 , pp. 1900-1904
- Runnels, S.R.¹

2
- 0026204737
- A two-dimensional process model for chemimechanical polish planarization
- J. Warnock, "A two-dimensional process model for chemimechanical polish planarization", J. Electrochem. Soc, 138 (8), pp. 2398-2402, (1991).
- (1991) J. Electrochem. Soc , vol.138 , Issue.8 , pp. 2398-2402
- Warnock, J.¹

3
- 57649157589
- S.R. Runnels and T. Olavson, J. Electrochem. Soc. 142 (6), pp. 1698-1701 (1995).
- (1995) J. Electrochem. Soc , vol.142 , Issue.6 , pp. 1698-1701
- Runnels, S.R.¹ Olavson, T.²

4
- 84888254408
- Semi-empirical modeling of SiO2 chemical-mechanical polishing
- P.A. Burke, "Semi-empirical modeling of SiO2 chemical-mechanical polishing", Proc. VMIC Conf., pp. 379-384 (1991).
- (1991) Proc. VMIC Conf , pp. 379-384
- Burke, P.A.¹

5
- 0029510623
- Practical Issues in Run by Run Process Control
- Boston, Nov
- D. Boning, W. Moyne, T. Smith, J. Moyne and A. Hurwitz, "Practical Issues in Run by Run Process Control, Sixth Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference, Boston, Nov. 1995, pp. 201-208.
- (1995) Sixth Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference , pp. 201-208
- Boning, D.¹ Moyne, W.² Smith, T.³ Moyne, J.⁴ Hurwitz, A.⁵

6
- 0027843403
- Application of run by run controller to the chemicalmechanical planarization process: Part I
- th IEEE/CHMT Intl Elec Manuf Tech (IEMT) Soc (1993), pp. 235-240.
- (1993) th IEEE/CHMT Intl Elec Manuf Tech (IEMT) Soc , pp. 235-240
- Hu, A.¹ Zang, X.² Sachs, E.³ Renteln, P.⁴

7
- 0028749252
- Application of run by run controller to the chemical-mechanical planarization process: Part II
- th IEEE/CHMT Intl Elec Manuf Tech (IEMT) Soc Part 1 (1994), pp. 371-378.
- (1994) th IEEE/CHMT Intl Elec Manuf Tech (IEMT) Soc , Issue.PART 1 , pp. 371-378
- Hu, A.¹ Du, H.² Wong, S.³ Renteln, P.⁴ Sachs, E.⁵

8
- 0000669122
- The Exponentially Weighted Moving Average
- Oct
- J. S. Hunter, "The Exponentially Weighted Moving Average", J. Of Quality Tech., 18 no. 4, Oct. 1986.
- (1986) J. Of Quality Tech , vol.18 , Issue.4
- Hunter, J.S.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.