Development of microwave multilayer plastic-based multichip modules

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 1, 2001, Pages 37-40

  Pham, Anh Vu H ^a,b   Sutono, Albert ^c   Laskar, Joy ^c   Krishnamurthy, V ^d,e   Lester, D ^d   Balch, E ^d   Rose, J ^d  

^a IEEE   (United States)

^b AMRL   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^d GENERAL ELECTRIC COMPANY   (United States)

^e NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

BGA; MCM; Microwave; Package; Plastic; Vertical interconnects

Indexed keywords

BALL GRID ARRAY; LOW NOISE AMPLIFIER; VERTICAL INTERCONNECTS;

COPPER; MICROWAVE AMPLIFIERS; MICROWAVE INTEGRATED CIRCUITS; MULTICHIP MODULES; MULTILAYERS; PLASTIC FILMS; POLYIMIDES; POWER AMPLIFIERS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THIN FILMS;

ELECTRONICS PACKAGING;

EID: 0035248463     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.909623     Document Type: Article

References (10)

1. Highly integrated RF-ICs for GSM and DECT systems-A status review
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3. A C-band GaAs MMIC T/R module using microwave high-density-interconnect technology
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5. Multichip-on-flex plastic encapsulated MHDI-low cost substrateless manufacturing for microwave and millimeter wave modules
6. Ultra low loss millimeter wave multichip module interconnects
7. The equivalent circuit of a via
8. A two layer hermetic-like coating process for on-wafer encapsulation of GaAs MMICs