Scalloping minimization in deep Si etching on unaxis DSE tools

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4979, Issue , 2003, Pages 43-50

  Lai, Shouliang ^a   Johnson, Dave ^a   Westerman, Russ ^a   Nolan, John ^a   Purser, David ^a   Devre, Mike ^a  

^a Unaxis USA Inc   (United States)

Author keywords

Deep Si etch; Gas switching; MEMS devices; Scallop minimization; Smooth sidewall

Indexed keywords

ETCHING; INDUCTIVELY COUPLED PLASMA; MICROELECTROMECHANICAL DEVICES; OPTIMIZATION; PASSIVATION; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SUBSTRATES; SWITCHING THEORY;

DEEP SILICON ETCHING; GAS SWITCHING TECHNIQUE; SIDEWALL SMOOTHNESS; TIME DIVISION MULTIPLEX ETCH PROCESS; UNIAXIS DEEP SILICON ETCHING;

MICROELECTRONIC PROCESSING;

EID: 0041562467     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.472750     Document Type: Conference Paper

References (8)

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