Optimum process performance through better CMP slurry management

Solid State Technology

Volumn 46, Issue 8, 2003, Pages 63-64+66

  Johl, Budge ^a   Singh, Rakesh K ^b  

^a Rodel Inc   (United States)

^b BOC Edwards   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; AGGLOMERATION; BLENDING; COLLOIDS; IONS; PHOTONS; SILICON WAFERS; SLURRIES;

CERIA; COST OF OWNERSHIP; DOCK TIME; RESIDUAL SLURRY PARTICLES;

CHEMICAL MECHANICAL POLISHING;

EID: 0041382987     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

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