A SYSTEM FOR FIRST ORDER RELIABILITY ESTIMATION OF SOLDER JOINTS IN AREA ARRAY PACKAGES

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 1998-R, Issue , 1998, Pages 767-777

  Deshpande, Anand M ^a   Subbarayan, Ganesh ^a   Rose, Dan ^b  

^a University of Colorado at Boulder   (United States)

^b Sun StorageTek   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; MOIRE FRINGES; NEURAL NETWORKS; RELIABILITY ANALYSIS;

ARRAY PACKAGES; ARTIFICIAL NEURAL NETWORK MODELING; DESIGN PROCEDURE; DESIGN-PROCESS; FIRST ORDER RELIABILITY; PROCESS PARAMETERS; RELIABILITY ESTIMATION; SIMULTANEOUS ANALYSIS AND DESIGNS; SOLDER JOINTS; VALUE OF DESIGNS;

PERSONAL COMPUTERS;

EID: 0041167439     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE1998-1091     Document Type: Conference Paper

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