Measurement and simulation of junction to board thermal resistance and its application in thermal modeling

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1999, Pages 212-220

  Joiner, Bennett ^a   Adams, Vance ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; HEAT RESISTANCE; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR JUNCTIONS; SURFACE MOUNT TECHNOLOGY; THERMAL VARIABLES MEASUREMENT;

JUNCTION-TO-AMBIENT THERMAL RESISTANCE;

ELECTRONICS PACKAGING;

EID: 0032639475     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)