Lead-On-Chip versus chip-On-Leadpackages and solder failure criteria

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 3, 2000, Pages 279-280

  Mirman, Boris ^a  

^a WEIDLINGER ASSOCIATES INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039877081     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.1286105     Document Type: Article

References (12)

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2. Visvanadham, P., Stennett, M., Emerick, A., and Haggett, R., 1993, “Second Level Assembly and Reliability Aspect of TSOPs,” Proc. of ASME-EEP, Sept., 1127-1134.
3. The American Society for Metals, 1948, “Metals Handbook,” 1948 Edition, p. 1144.
4. Engelmaier, W., and Fuentes, B., 1995, “Alloy-42—a Material To Be Avoided for Surface Mount Component Leads and Lead Frames,” West, pp. 1730-1742.
5. Engelmaier, W., 1983, “Fatigue Life of LLCC Solder Joints During Power Cycling,” CHMT, 6, No. 3, Sept.
6. Engelmaier, W., 1984, “Functional Cycling and SM Attachment Reliability,” ISHM Technical Monograph Series, 6984-002, pp. 84-114.
7. Solomon, H. D., 1986, “Creep, Strain Rate Sensitivity, and Low-Cycle Fatigue of 60-40 Solder,” GE Technical Information Series, Sept.
8. Shine, M. C., and Fox, L. R., 1987, “Fatigue of Solder Joints in Surface Mount Devices,” Low Cycle Fatigue—ASTM Special Technical Publication 942, 588-610.
9. Iannuzzelli, R., 1990, “Validation of Module Assembly Physical Models,” 40th ECTC, May 21-23.
10. Knecht, S., and Fox, L., 1991, “Integrated Matrix Creep: Application to Accelerated Testing and Lifetime Prediction,” Solder Joint Reliability, Ed. J. H. Lau.
11. Knecht, S., 1990, “Integrated Matrix Creep: Application to Lifetime Prediction of Eutectic Tin-Lead Solder Joints,” Mater. Res. Soc. Symp. Proc.
12. Mohr, O., 1900, “Welche Umstaande bedingen die Elastizitatgrenze und den Bruch eines Materials?” Zeitschrift des Vereines deutscher Ingenieure, 44, pp. 1524-1530.