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Volumn , Issue , 1996, Pages 295-311
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Choice of models and failure indicators for thermally loaded solder joints
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Author keywords
[No Author keywords available]
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Indexed keywords
CHIP ON LEAD CONFIGURATION;
FAILURE INDICATORS;
LEAD ON CHIP CONFIGURATION;
SOLDER REFLOW;
THIN SMALL OUTLINE PACKAGES;
VIRTUAL STRUCTURE CONCEPT;
COMPUTER SIMULATION;
ELASTIC MODULI;
FAILURE (MECHANICAL);
FINITE ELEMENT METHOD;
MICROSTRUCTURE;
RELIABILITY;
STRESS ANALYSIS;
SOLDERED JOINTS;
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EID: 0029705661
PISSN: 04700155
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (1)
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References (26)
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