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Thin Solid Films

Volumn 394, Issue 1-2, 2001, Pages 271-275

Application of linear annealing method to Si||SiO2/Si wafer direct bonding

(4) Lee, J W a Kang, C S a Song, O S b Kim, C K c

a Seoul National University (South Korea)

b University of Seoul (South Korea)

c Hanyang University (South Korea)

Author keywords

Direct wafer bonding; Linear annealing method; Silicon on insulator (SOI)

Indexed keywords

ANNEALING; SILICON ON INSULATOR TECHNOLOGY; SUBSTRATES; TENSILE TESTING; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY;

DIRECT WAFER BONDING; LINEAR ANNEALING METHODS;

SILICON WAFERS;

EID: 0035882074 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/s0040-6090(01)01165-8 Document Type: Article

Times cited : (3)

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