Diamond thick film deposition in wafer scale using single-cathode direct current plasma assisted chemical vapour deposition

Thin Solid Films

Volumn 435, Issue 1-2, 2003, Pages 89-94

  Lee, Wook Seong ^a   Baik, Young Joon ^a   Chae, Ki Woong ^b  

^a Korea Institute of Science and Technology   (South Korea)

^b Hoseo University   (South Korea)

Author keywords

DC plasma; Diamond wafer; Large area; Uniformity

Indexed keywords

FILM GROWTH; HYDROGEN; METHANE; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; RAMAN SCATTERING; RESIDUAL STRESSES; THERMAL CONDUCTIVITY; THICK FILMS;

DIAMOND WAFERS;

DIAMOND FILMS;

EID: 0038746625     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)00410-3     Document Type: Conference Paper

References (5)

1. Prelas M.A., Popoici G., Bigelow L.K. Handbook of Industrial Diamond and Diamond Films. 1998;Marcel Dekker Inc.
2. Gray K.J., Windischmann H. Diamond Relat. Mater. 8:1999;903.
3. Füner M., Wild C., Koidl P. Surf. Coat. Technol. 116-119:1999;853.
4. Lee W.-S., Chae K.-W., Eun K.-Y., Baik Y.-J. Diamond Relat. Mater. 10:2001;2220.
5. Relya H., White M., McGrath J.J., Beck J.V. Diamond Relat. Mater. 7:1998;1207.