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Volumn 17, Issue 7, 2003, Pages 995-1016

Thermal non-linear elastic stress analysis of an adhesively bonded T-joint

Author keywords

Epoxy adhesive; Geometrical non linearity; Steel adherends; T joint; Thermal analysis; Thermal stresses

Indexed keywords

ADHESIVES; BOUNDARY CONDITIONS; CHEMICAL BONDS; HEAT TRANSFER; STRESS ANALYSIS; THERMAL STRESS; ADHESIVE JOINTS; FINITE ELEMENT METHOD; MECHANICAL PROPERTIES; STRESS CONCENTRATION; TEMPERATURE DISTRIBUTION; THERMOANALYSIS;

EID: 0038719147     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856103322112897     Document Type: Article
Times cited : (10)

References (39)
  • 8
    • 0002837233 scopus 로고
    • A. J. Kinloch (Ed.), Elsevier Applied Science, London
    • R. D. Adams, in: Developments in Adhesives - 2, A. J. Kinloch (Ed.), pp. 45-81. Elsevier Applied Science, London (1981).
    • (1981) Developments in Adhesives , vol.2 , pp. 45-81
    • Adams, R.D.1
  • 39
    • 0037546710 scopus 로고    scopus 로고
    • Swanson Analysis Systems, Inc., Houston, TX
    • ANSYS (5.5), Swanson Analysis Systems, Inc., Houston, TX (2000).
    • (2000) ANSYS (5.5)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.