Two-dimensional transient thermal stress analysis of adhesive butt joints

Journal of Adhesion

Volumn 70, Issue 1, 1999, Pages 75-93

  Katsuo, Masahide ^a   Nakano, Yuichi ^a   Sawa, Toshiyuki ^b  

^a SHONAN INSTITUTE OF TECHNOLOGY   (Japan)

^b UNIVERSITY OF YAMANASHI   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; PHOTOELASTICITY; STRESS ANALYSIS; STRESS CONCENTRATION; TEMPERATURE DISTRIBUTION; THERMAL EFFECTS; THERMOANALYSIS; THERMOELASTICITY;

ADHESIVE BUTT JOINTS; ELASTICITY THEORY;

ADHESIVE JOINTS;

EID: 0032670207     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218469908010488     Document Type: Article

References (7)

1. Suhir, E., "Approximate Evaluation of the Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate", ASME J. Electronic Packaging 116, 171-176 (1994).
2. Yin, Wan-Lee, "Interfacial Thermal Stresses in Layered Structures: The Stepped Edge Problem", J. of Electronic Packaging 117, 153-158 (1995).
3. Nakano, Y., Sawa, T. and Nakagawa, F., "Two-dimensional Thermal Stress Analysis of Butt Adhesive Joint", JSME Intl. J Ser. I 35(2), 145-151 (1992).
4. Tanigawa, Y., Murakami, H. and Ootao, Y., "Transient Thermal Stress Analysis of a Laminated Composite Beam", J. Thermal Stresses 12, 25-39 (1989).
5. King, D. and Bell, J. P., "Thermal Shock Failure in Thick Epoxy Coatings", J. Adhesion 26, 37-58 (1988).
6. Kokini, K. and Smith, C. C., "Interfacial Transient Thermal Fracture of Adhesively Bonded Dissimilar Materials", Exper. Mechanics 29, 312-317 (1989).
7. Carslaw, H. S. and Jaeger, J. C., Conduction of Heat in Solids (Oxford University Press, Oxford, 1959).