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Journal of Adhesion Science and Technology

Volumn 13, Issue 3, 1999, Pages 309-323

A two-dimensional finite element thermal stress analysis of adhesive butt j oints containing some hole defects

(4) Nakagawa, Fumito a Sawa, Toshiyuki b Nakano, Yuichi c Katsuo, Masahide c

a TOKYO METROPOLITAN COLLEGE OF AERONAUTICAL ENGINEERING (Japan)

b UNIVERSITY OF YAMANASHI (Japan)

c SHONAN INSTITUTE OF TECHNOLOGY (Japan)

Author keywords

Adhesive butt joints; FEM analysis; Hole defects; Photoelasticity; Stress concentration; Thermal stress

Indexed keywords

ADHESIVES; DEFECTS; ELASTIC MODULI; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); PHOTOELASTICITY; STRESS ANALYSIS; STRESS CONCENTRATION; THERMAL STRESS; BUTT WELDING; ELASTICITY; TWO DIMENSIONAL;

ADHESIVE BUTT JOINTS;

ADHESIVE JOINTS; DEFECTS;

ADHERENDS; ADHESIVE LAYERS; BUTT JOINTS; FEM ANALYSIS; FINITE ELEMENT; FREE SURFACES; HOLE DEFECT; THERMAL STRESS DISTRIBUTIONS; TWO DIMENSIONAL FINITE ELEMENT METHOD; UNIFORM TEMPERATURE; YOUNG'S MODULUS;

EID: 0032632589 PISSN: 01694243 EISSN: 15685616 Source Type: Journal
DOI: 10.1163/156856199X00659 Document Type: Article

Times cited : (26)

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