Intelligent control of via formation process in MCM-L/D substrates using neural networks

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 106-112

  Kim, T S ^a   May, G S ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GENETIC ALGORITHMS; INTERFACES (MATERIALS); MANUFACTURE; MULTICHIP MODULES; OPTIMIZATION; PACKAGING MATERIALS;

FORMATION PROCESS; LOW COST MANUFACTURING; OUTPUT RESPONSE; PROCESS DISTURBANCES; PROCESS RESPONSE; PROCESS VARIATION; SEQUENTIAL NEURAL NETWORKS; SUPERVISORY CONTROL;

PROCESS CONTROL;

EID: 0038708635     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757296     Document Type: Conference Paper

References (14)

1. T. Kim and G. May, "Modeling of Via Formation by Photosensitive Dielectric Materials for MCM Applications, " Proc. 5th Internat'l Conf. on Prop. and Appl. of Dielectric Mat., May, 1997.
2. J. Baras and N. Patel, "Designing a Response Surface Model- Based Run-to-Run Controller: A Worst Case Approach, " IEEE Trans Comp., Pack., & Manufac. Tech. C, vol. 19, no. 2, April, 1996.
3. C. Himmel and G. May, "Advantages of Plasma Etch Modeling Using Neural Networks Over Statistical Techniques, " IEEE Trans. Semi. Manufac., vol. 6, no. 2, May, 1993.
4. T. Kim and G. May, "Modeling Via Formation in Photosensitive MCM Dielectric Materials Using Sequential Neural Networks, " Proc. 1998 Internat'l Elec. Manufact. Tech. Symp., Oct., 1998.
5. T. Kim and G. May, "Optimization of Via Formation in Photosensitive Dielectric Layers Using Neural Networks and Genetic Algorithms, " Proc. 1998 World Multiconference on Systems, Cybemetics, andlnfonnatics, vol. 1, July, 1998.
6. E. Sachs, R. Guo, S. Ha, and A. Hu, "Process Control System for VLSI Fabrication, " IEEE Trans. Semi. Manufac., vol. 4, no. 2, May, 1991.
7. C. Spanos, S. Leang, and S. Lee, "A Control & Diagnosis Scheme for Semconductor Manufacturing, " Proc. American Control Cont. June, 1993.
8. T. Shimoto, K. Matsui, and K. Utsumi, "CulPhotosensitive BCB Thin Film Multilayer Technology for High-Performance Multichip Module, " Proc. Int'l Conf. on MCMs, April, 1994.
9. T. Miyagi, Y. Iseki, K. Higuchi, T. Hanawa, E. Takagi, M. Saito, K. Yoshihara, and M. Konno, "MCM-DL Using CopperPhotosensitive BCB Multilayer for Upper Microwave Band Systems, " Proc. Elec. Comp. & Tech. Conf., May, 1996.
10. A. Krauss and E. Kamen, "Meniscus Coating for Electronics Packaging, " Advanced Packaging, vol. 6, no. 4, May, 1998.
11. B. Kim and G. May, "An Optimal Neural Network Process Model for Plasma Etching, " IEEE Trans. Semi. Manufac., vol. 7, no. 1, Feb., 1994.
12. S. Han and G. May, "Using Neural Network Process Models to Perform PECVD Silicon Dioxide Recipe Synthesis via Genetic Algorithms, " IEEE Trans. Semi. Manufac., vol. 10, no. 2, May, 1997.
13. J. Nelder and R. Mead, "A Simplex Method for Function Minimization, " Computer Journal, vol. 7, 1965.
14. D. Montgomery, Statistical Quality Control, New York: Wiley, 1991.