Fabrication of highly conductive stressed-metal springs and their use as sliding-contact interconnects

Microelectronic Engineering

Volumn 67-68, Issue , 2003, Pages 690-695

  Hantschel, T ^a   Wong, L ^a   Chua, C L ^a   Fork, D K ^a  

^a PALO ALTO RESEARCH CENTER   (United States)

Author keywords

Electronic packaging; Interconnect; Plating; Spring; Stressed metal

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; FLIP FLOP CIRCUITS; METALLIC FILMS; SOLDERING ALLOYS; THICK FILMS;

STRESSED-METAL;

ELECTRIC CONNECTORS;

EID: 0038696516     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(03)00174-6     Document Type: Conference Paper

References (3)

1. Smith D.L., Alimonda A.S. Proc. 48th Electronic Components and Technology Conf., Orlando, FL, May 1996:1996;325.
2. Fork D.K., Chua C.L., Kim P., Romano L.T., Lau R., Wong L., Alimonda A., Geluz V., Teepe M., Haemer J., Modi M.B., Zhu Q., Ma D., Sitaraman S., Smith D.L., Mok S. SPIE Proc. 4176:2000;226.
3. Chua C.L., Fork D.K., Hantschel T. IEEE Photonics Technol. Lett. 14:(6):2002;846.