Nano-spring arrays for high density interconnect

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4176, Issue 1, 2000, Pages 226-235

  Fork, David K ^a   Chua, Christopher ^a   Kim, Patrick ^a   Romano, Linda ^a   Lau, Rachel ^a   Wong, Lai ^a   Alimonda, Andrew S ^a   Geluz, Vicki ^a   Teepe, Mark ^a   Haemer, Joe ^b   Modi, Mitul ^b   Zhu, Qi ^b   Ma, Dennis ^b   Sitaraman, Suresh ^b   Smith, Donald L ^c   Mok, Sammy ^c  

^a PALO ALTO RESEARCH CENTER   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c NanoNexus Inc   (United States)

Author keywords

Interconnects; Packaging; Probing; Sputtering; Stress; Thin film

Indexed keywords

ELECTRONICS PACKAGING; SEMICONDUCTING FILMS; SPUTTERING; STRESS ANALYSIS; THIN FILMS;

COMPLIANT INTERCONNECTS;

INTERCONNECTION NETWORKS;

EID: 0038429514     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.395634     Document Type: Article

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