Analysis on resin removal in laser drilling of printed circuit board

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4830, Issue , 2002, Pages 46-51

  Noguchi, Satoru ^a   Ohmura, Etsuji ^a   Miyamoto, Isamu ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Enthalpy method; FEM; Laser drilling; Latent heat of evaporation; Printed circuit board; Removal velocity; Smear

Indexed keywords

ENTHALPY; EVAPORATION; FINITE ELEMENT METHOD; HEAT CONDUCTION; LIGHT ABSORPTION; PRINTED CIRCUIT BOARDS; RESINS;

LASER DRILLING;

LASER BEAM EFFECTS;

EID: 0038662982     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.499621     Document Type: Conference Paper

References (4)

1. T. Hirogaki, E. Aoyama, H. Inoue, K. Ogawa, S. Maeda and T. Katayama: Composites, Part A, Applied Science and Manufacturing, 32-7(2001), 963.
2. R. Inaba, T. Kawamura, H. Akahoshi and K. Arai: IEEE Transactions on Electronics Packaging Manufacturing, 24-1(2001), 39.
3. F. Sauert, E. Schultze-Rhonhof and W.S. Sheng: Thermochemical Data of Pure Substances, VCH, (1989).
4. Plastics Data Book, Kogyo Chosakai, (1999). (in Japanese)