Studies on CO2 laser drilling: Formation mechanism of residual thin materials at the bottom of laser via

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 24, Issue 1, 2001, Pages 39-43

  Inaba, Ryoji ^a,b   Kawamura, Toshinori ^b   Akahoshi, Haruo ^a,b   Arai, Kunio ^b,c  

^a IEEE   (Japan)

^b HITACHI LTD   (Japan)

^c Hitachi Via Mechanics Ltd   (Japan)

Author keywords

CO2 laser; Heat transfer simulation; Laser via; Temperature

Indexed keywords

EPOXY FILMS;

CARBON DIOXIDE LASERS; HEAT TRANSFER; LASER BEAM EFFECTS; PRINTED CIRCUIT BOARDS; THIN FILMS;

DRILLING;

EID: 0034948587     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.924791     Document Type: Article

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4. 2 laser irradiation
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8. New copper surface treatment for polyimide multilayer printed wiring boards
9. Characterization of brominated poly(4-hydroxystyrene) derivatives containing unsaturated groups