Laser drilling of blind via holes in aramid and glass/epoxy composites for multi-layer printed wiring boards

Composites - Part A: Applied Science and Manufacturing

Volumn 32, Issue 7, 2001, Pages 963-968

  Hirogaki, T ^a   Aoyama, E ^b   Inoue, H ^c   Ogawa, K ^d   Maeda, S ^b   Katayama, T ^b  

^a UNIVERSITY OF SHIGA PREFECTURE   (Japan)

^b DOSHISHA UNIVERSITY   (Japan)

^c Osaka Prefecture University   (Japan)

^d MURATA MANUFACTURING CO LTD   (Japan)

Author keywords

A. Aramid fibre; A. Glass fibres; B. Strength; E. Machining; Printed wiring board

Indexed keywords

CARBON DIOXIDE LASERS; COPPER; EPOXY RESINS; ETCHING; LASER BEAM EFFECTS; LASER PULSES; MACHINING; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; STRENGTH OF MATERIALS; SURFACE ROUGHNESS;

ARAMID FIBERS;

GLASS FIBER REINFORCED PLASTICS;

EID: 0035401142     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-835X(00)00152-4     Document Type: Conference Paper

References (10)

1. 2 laser with multimodal-GAUSSIAN distribution
2. 2 sources
3. Investigation of laser grooving for composite materials
4. 2 laser
5. Laser cutting of non-metallic composites
6. Machining of fiber reinforced plastics
7. Laser cutting of fiber-reinforced polyesters
8. Study on small diameter drilling in GFRP
9. Study on laser drilling in PWB (small diameter drilling in GFRP). Processing and manufacturing
10. Prediction of damage width in laser drilling of printed wiring board using FEM