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Volumn , Issue , 1999, Pages 1235-1240
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Fabrication process of copper lead frame chip scale package (LF-CSP)
a
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTER SIMULATION;
ETCHING;
FABRICATION;
FLIP CHIP DEVICES;
SCHEMATIC DIAGRAMS;
SURFACE MOUNT TECHNOLOGY;
THICKNESS MEASUREMENT;
COPPER LEAD FRAME CHIP SCALE PACKAGE;
EPOXY MOLDING COMPOUND;
THIN SMALL OUTLINE PACKAGE;
ELECTRONICS PACKAGING;
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EID: 0032680622
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
Times cited : (2)
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References (7)
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