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Volumn , Issue , 1999, Pages 1235-1240

Fabrication process of copper lead frame chip scale package (LF-CSP)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ETCHING; FABRICATION; FLIP CHIP DEVICES; SCHEMATIC DIAGRAMS; SURFACE MOUNT TECHNOLOGY; THICKNESS MEASUREMENT;

EID: 0032680622     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article
Times cited : (2)

References (7)
  • Reference 정보가 존재하지 않습니다.

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.