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Volumn , Issue , 2003, Pages 662-665

High-cycle fatigue test of nanoscale Si and SiO2 wires based on AFM technique

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; BENDING (DEFORMATION); ELASTOPLASTICITY; MICROELECTROMECHANICAL DEVICES; NANOSTRUCTURED MATERIALS; PLASTIC DEFORMATION; SILICA; SILICON; SINGLE CRYSTALS; STRESSES; SURFACE STRUCTURE; THERMAL EFFECTS;

EID: 0038493953     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (24)

References (5)
  • 4
    • 0035948962 scopus 로고    scopus 로고
    • Tensile-mode fatigue testing of silicon films as structural materials for MEMS
    • T. Ando, M. Shikida and K. Sato, "Tensile-mode fatigue testing of silicon films as structural materials for MEMS", Sensors and Actuators A, vol. 93, pp. 70-75, 2001.
    • (2001) Sensors and Actuators A , vol.93 , pp. 70-75
    • Ando, T.1    Shikida, M.2    Sato, K.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.