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Volumn , Issue , 2003, Pages 61-64
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Damage-free SiO2/SiNx side-wall gate process and its application to 40nm InGaAs/InAIAs HEMT's with 65% InGaAs channel
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRON GAS;
EXTRAPOLATION;
GATES (TRANSISTOR);
HIGH ELECTRON MOBILITY TRANSISTORS;
MICROWAVE MEASUREMENT;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
SCANNING ELECTRON MICROSCOPY;
SEMICONDUCTING INDIUM GALLIUM ARSENIDE;
SEMICONDUCTOR DEVICE STRUCTURES;
SILICA;
SILICON NITRIDE;
TWO DIMENSIONAL;
ARSENIC COMPOUNDS;
DIELECTRIC MATERIALS;
ETCHING;
GALLIUM ARSENIDE;
INDIUM;
INDIUM COMPOUNDS;
INDIUM PHOSPHIDE;
PLASMA APPLICATIONS;
PLASMA SOURCES;
SEMICONDUCTING INDIUM;
SILICON COMPOUNDS;
SILICON OXIDES;
SULFUR HEXAFLUORIDE;
HALL MOBILITY;
INDIUM ALUMINUM ARSENIDE;
SIDE-WALL GATE PROCESS;
TWO DIMENSIONAL ELECTRON GAS DENSITY;
SEMICONDUCTOR DEVICE MANUFACTURE;
HIGH ELECTRON MOBILITY TRANSISTORS;
DIELECTRIC LAYER;
HEMTS;
INDIUM GALLIUM ARSENIDE;
INGAAS/INALAS;
ITS APPLICATIONS;
PLASMA PROPERTIES;
PROCESS CONDITION;
STRAINED CHANNELS;
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EID: 0038487284
PISSN: 10928669
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (3)
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References (7)
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