Spreading and solidification of a molten microdrop in the solder jet bumping process

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 1, 2003, Pages 215-221

  Yang, Young Soo ^a   Kim, Ho Young ^b   Chun, Jung Hoon ^c  

^a Chonnam National University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

^c Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

Area array packaging; Recoiling; Solder bump; Variational principle

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; LIQUID METALS; MATHEMATICAL MODELS; NUMERICAL METHODS; SOLIDIFICATION; SUBSTRATES; TEMPERATURE; VARIATIONAL TECHNIQUES;

AREA ARRAY PACKAGING; NON NEWTONIAN SLURRY; SOLDER JET BUMPING PROCESS;

SOLDERING;

EID: 0038481220     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.806786     Document Type: Article

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