Development of shielded cathodic arc deposition with a superconductor shield

Surface and Coatings Technology

Volumn 171, Issue 1-3, 2003, Pages 162-166

  Takikawa, Hirofumi ^a   Miyakawa, Nobuhide ^a   Sakakibara, Tateki ^a  

^a TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

Cathodic arc deposition; Magnetic field; Meissner effect; Plasma transportation; Shielded method; Superconductor shield; TiN film

Indexed keywords

CATHODES; IONS; PLATING; SUBSTRATES; SUPERCONDUCTING FILMS; TITANIUM NITRIDE; VACUUM;

CATHODIC ARC DEPOSITION;

DEPOSITION;

CATHODIC ARC PLASMA DEPOSITION; FILM; ION PLATING; SUPERCONDUCTOR; TITANIUM NITRIDE;

EID: 0038382928     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(03)00262-7     Document Type: Article

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