Air mesh plasma for PCB de-smear process

Surface and Coatings Technology

Volumn 171, Issue 1-3, 2003, Pages 328-332

  Lee, Eung Suok ^a   Park II, Hae ^a   Baik, Hong Koo ^a   Lee, Se Jong ^b   Song, Kie Moon ^c   Hwang, Myung Keun ^d   Huh, Chang Su ^d  

^a Yonsei University   (South Korea)

^b Kyungsung University   (South Korea)

^c Konkuk University   (South Korea)

^d Inha University   (South Korea)

Author keywords

Atmospheric air mesh plasma; Blind vias; Desmearing process; Wire bondability

Indexed keywords

ATMOSPHERIC PRESSURE; GLOW DISCHARGES; OXYGEN; OZONE; PLATING; PRINTED CIRCUIT BOARDS; SOLDERING; SURFACES;

AIR MESH PLASMAS;

PLASMAS;

GLOW DISCHARGE CLEANING; PLASMA TREATMENT;

EID: 0038382883     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(03)00295-0     Document Type: Article

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