Microvia materials: enablers for high density interconnects

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 1997, Pages 31-34

  Paulus, James ^a   Petti, Michael ^a  

^a AlliedSignal   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; LASER ABLATION; PLASMA APPLICATIONS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; THIN FILMS;

HIGH DENSITY INTERCONNECTS; MICROVIA MATERIALS;

DIELECTRIC MATERIALS;

EID: 0030716611     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (0)