Determining the stress-strain behaviour of small devices by nanoindentation in combination with inverse methods

Microelectronic Engineering

Volumn 67-68, Issue , 2003, Pages 818-825

  Stauss, S ^a,b   Schwaller, P ^a   Bucaille, J L ^a   Rabe, R ^a   Rohr, L ^a   Michler, J ^a   Blank, E ^b  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b EPFL   (Switzerland)

Author keywords

Finite element simulation; Inverse method; LIGA process; Mechanical properties; Nanoindentation

Indexed keywords

COMPUTER SIMULATION; ELASTIC MODULI; INDENTATION; LITHOGRAPHY; MICROSTRUCTURE; STRAIN; STRESSES; THIN FILMS;

NANOINDENTATION;

MICROELECTROMECHANICAL DEVICES;

EID: 0038358260     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(03)00192-8     Document Type: Conference Paper

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