Effects of mask misalignment and wafer misorientation on silicon V-groove etching

Sensors and Materials

Volumn 15, Issue 2, 2003, Pages 101-112

  Tan, Songsheng ^a   Boudreau, Robert ^a   Reed, Michael L ^b  

^a Corning Inc ^*  (United States)

^b University of Virginia   (United States)

Author keywords

Anisotropic; MEMS; Micromachining; Misaligned; Silicon etching; V groove

Indexed keywords

EID: 0038353668     PISSN: 09144935     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. C. A. Armiento, M. J. Tabasky, J. Chirravuri, M. A. Rothman, A. N. M. M. Choudhury, A. J. Negri, A. J. Budman, T. W. Fitzgerald, V. J. Barry and P. O. Haugsjaa: SPIE Proceedings 1582 (1991) p. 112.
2. A. Goto, S. Nakamura, K. Kurata, K. Komatsu and S. Ishikawa: IEEE Transactions on Components Packaging & Manufacturing Technology B 21 (1998) 140.
3. M. Vangbo and Y. Backlund: Journal of Micromechanics and Microengineering 6 (1996) 279.
4. A. J. Nijdam, E. van Veenendaal, H. Cuppen, J. van Suchtelen, M. L. Reed, J. G. E. Gardeniers, W. J. P. van Enckevort, E. Vlieg and M. Elwenspoek: Journal of Applied Physics 89 (2001) 4113.
5. M. Elwenspoek: Journal of the Electrochemical Society 140 (1993) 2075.
6. R. Wiesendanger et al.: Europhysics Letters 12 (1990) 57.
7. M. Shikida, K. Tokoro, D. Uchikawa and K. Sato: Journal of Micromechanics and Microengineering 10 (2000) 522.
8. Semiconductor Equipment and Materials International (SEMI), "Specifications for polished monocrystalline silicon wafers," SEMI Standard M1.15-0302, 2002.
9. S. Tan, R. Boudreau and M. L. Reed: Sensors and Materials 13 (2001) 303.