Low-loss and high-frequency interconnection technology on membrane supported by porous silicon post

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 42, Issue 4 B, 2003, Pages 2478-2482

  Ko, Ju Hyun ^a   Nam, Choong Mo ^b   Jeong, In Ho ^b   Kwon, Young Se ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Telephus Inc   (South Korea)

Author keywords

Coplanar waveguide (CPW); Isotropic wet etching; Membrane; Multichip module package; Oxidized porous silicon (OPS); Porous silicon (PS); Thin film

Indexed keywords

DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; ENERGY GAP; ETCHING; MULTICHIP MODULES; SODIUM COMPOUNDS; THIN FILMS; WAVEGUIDES;

ETCHANT; HIGH FREQUENCY INTERCONNECTION TECHNOLOGY; OXIDIZED POROUS SILICON;

POROUS SILICON;

EID: 0038346814     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.2478     Document Type: Article

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