Copper deposition and subsequent grain structure evolution in narrow lines

Materials Science Forum

Volumn 426-432, Issue 3, 2003, Pages 2485-2490

  Brongersma, S H ^a   D'Haen, J ^b   Vanstreels, K ^b   DeCeuninck, W ^b   Vervoort, I ^a   Maex, K ^a,c  

^a IMEC   (Belgium)

^b HASSELT UNIVERSITY   (Belgium)

^c UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Copper; Grain growth; Real time SEM

Indexed keywords

ADDITIVES; CRYSTAL MICROSTRUCTURE; CRYSTALLIZATION; ELECTROPLATING; GRAIN GROWTH; GRAIN SIZE AND SHAPE; MICROELECTRONICS; REAL TIME SYSTEMS; SCANNING ELECTRON MICROSCOPY;

NARROW LINES;

COPPER;

EID: 0038338960     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.426-432.2485     Document Type: Conference Paper

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