Strain-rate dependence of dynamic twin nucleation at triple junction in copper

Materials Science Forum

Volumn 426-432, Issue 5, 2003, Pages 4387-4392

  Miura, H ^a   Andiarwanto, S ^a   Sakai, T ^a  

^a UNIVERSITY OF ELECTRO COMMUNICATIONS   (Japan)

Author keywords

Copper; Dynamic recrystallization; Grain boundary sliding; Nucleation; OIM; Triple junction; Twining

Indexed keywords

COPPER; CRYSTAL ORIENTATION; GRAIN BOUNDARIES; NUCLEATION; PROBABILITY; STRAIN RATE;

TRIPLE JUNCTIONS;

POLYCRYSTALLINE MATERIALS;

EID: 0038266563     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.426-432.4387     Document Type: Conference Paper

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