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Volumn 51, Issue 12, 2003, Pages 3585-3595

Backward deviation and depth recovery of load-displacement curves of amorphous SiC film under repeating nanoindentation

Author keywords

Backward deviation; Delamination; Depth recovery; Repeating nanoindentation; Residual stress; Sputtered SiC thin films

Indexed keywords

AMORPHOUS SILICON; DELAMINATION; INDENTATION; RESIDUAL STRESSES; SPUTTERING;

EID: 0038071576     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(03)00176-9     Document Type: Article
Times cited : (19)

References (25)
  • 3
    • 0000849603 scopus 로고
    • Micro indentation techniques in materials science and engineering
    • Oliver WC, Hutchings R, Pethica JB. Micro indentation techniques in materials science and engineering. ASTM STP 889; 1986. p. 90.
    • (1986) ASTM STP , vol.889 , pp. 90
    • Oliver, W.C.1    Hutchings, R.2    Pethica, J.B.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.