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Volumn , Issue , 1988, Pages 71-78
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Mathematical model of a plated-through-hole structure under a load induced by thermal mismatch.
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Author keywords
[No Author keywords available]
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Indexed keywords
STRESSES -- THERMAL;
PLATED-THROUGH-HOLE STRUCTURE;
THERMAL LOAD;
THERMAL MISMATCH;
PRINTED CIRCUITS;
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EID: 0024139271
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (3)
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References (10)
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