Temperature dependent mechanical behavior of plastic packaging materials

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1995, Pages 1054-1058

  Darveaux, Robert ^a   Norton, Laura ^a   Carney, Frank ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ELASTIC MODULI; FAILURE ANALYSIS; MATERIALS TESTING; MATHEMATICAL MODELS; MICROSTRUCTURE; PLASTIC PRODUCTS; SPECIMEN PREPARATION; THERMAL EFFECTS; THERMAL EXPANSION;

DYNAMIC MECHANICAL ANALYSIS; PLASTIC PACKAGING MATERIALS;

ELECTRONICS PACKAGING;

EID: 0029218601     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)