Experimental and numerical verification of fatigue life estimation for solder bumps

Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 65, Issue 636, 1999, Pages 1690-1695

  Mukai, Minora ^a   Takahasi, Hiroyuki ^b   Kawakami, Takashi ^b   Takahasi, Kuniaki ^b   Iwasaki, Ken ^b   Kishlmoto, Kikuo ^b   Shibuya, Tosikazu ^b  

^a TOSHIBA CORPORATION   (Japan)

^b NONE

Author keywords

Elastic creep behavior; Electronic device; Fatigue; Life prediction; Solder bump; Structural analysis

Indexed keywords

EID: 0038146496     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.65.1690     Document Type: Article

References (12)

1. Lau, J. H., IEEE Trans. CHMT-10, No.3 (1987), 316-357.
2. Yu, Q., Proceedings of the ASMEWAM, AMD-187 (1994), 205-211.
3. Hiruta, Y., IEEE Trans. CIIMT-16, No.8 (1993), 893-901.
4. Mukai, M., Proceedings of the ASMEWAM, AMD-187 (1994), 197-203.
5. Mukai, M., JSME Int. J. 41-2, A(1998), 260-266.
6. Mukai, M., Trans. ASME. J. Electronic Packaging. 120-2 (1998), 207-212.
7. Nagaraj. B., ASME Advances in Electronic Packaging. EEP-4-1 (1993). 537-543.