Pattern collapse improvement in ArF resist: Effect of surfactant-added rinse and soft bake

Journal of Photopolymer Science and Technology

Volumn 16, Issue 3, 2003, Pages 463-466

  Jung, Myoung Ho ^a   Kim, Hyun Woo ^a   Lee, Sung Ho ^a   Woo, Sang Gyun ^a   Cho, Han Ku ^a   Han, Woo Sung ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

ArF resist; Pattern collapse; Surfactant

Indexed keywords

SURFACTANT;

ARTICLE; LITHOGRAPHY; MOLECULAR MECHANICS; PROCESS TECHNOLOGY; SURFACE TENSION; TEMPERATURE; YOUNG MODULUS;

EID: 0037830547     PISSN: 09149244     EISSN: None     Source Type: Journal    
DOI: 10.2494/photopolymer.16.463     Document Type: Article

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