Si through-hole interconnections filled with Au-Sn solder by molten metal suction method

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2003, Pages 642-645

  Yamamoto, Satoshi ^a   Itoi, Kazuhisa ^a   Suemasu, Tatsuo ^a   Takizawa, Takashi ^a  

^a FUJIKURA LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ELECTRONICS PACKAGING; GOLD; LIQUID METALS; REACTIVE ION ETCHING; SILICON WAFERS; SOLDERING ALLOYS; SUBSTRATES; TIN;

DEEP REACTIVE ION ETCHING; HIGH-DENSITY PACKAGING; MOLTEN METAL SUCTION METHOD; THROUGH-HOLE INTERCONNECTION;

MICROELECTROMECHANICAL DEVICES;

EID: 0037817708     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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3. Kenji Takahashi, Hiroshi Terao, Yoshihiro Tomita, Yasuhiro Yamaji, Masataka Hoshino, Tomotoshi Sato, Tadahiro Morifuji Masahiro Sunohara and Manabu Bonkohara: "Current Status of Research and Development for Three-Dimensional Chip Stack Technology", Jpn. J. Appl. Phys. Vol.40, pp.3032-3037 (2001)
4. Takashi Takizawa, Satoshi Yamamoto, Kazuhisa Itoi, Hironari Nakamura and Tatsuo Suemasu: "Research for Conductive Interconnections through Silicon Substrates" Proc. of The Seventh International Micromachine Symposium, Tokyo, Japan, October 31-November1, 2001, pp.181-186
5. Takashi Takizawa, Satoshi Yamamoto, Kazuhisa Itoi and Tatsuo Suemasu: "Conductive Interconnections through Thick Substrates for 3D Packaging" Proc. of The Fifteenth IEEE International Conference on Micro Electro Mechanical Systems, Las Vegas, Nevada, USA, January 20-24, 2002, pp.388-391
6. Kazuo Kondo, Takuji Okamura, Jian Jun Sun, Manabu Tomisaka, Hitoshi Yonemura, Masataka Hoshino and Kenji Takahashi: "High Aspect Ratio Copper Via Fill used for Three Dimensional Chip Stacking" Proc. of 2002 International Conference on Electronics Packaging (ICEP), Tokyo, Japan, April 17-19, 2002, pp.327-332
7. Xinghua Li, Takashi Abe, Yongxun Liu and Masayoshi Esashi: "High Density Electrical Feedthrough Fabricated by Deep Reactive Ion Etching of Pyrex Glass" Proc. of The Fourteenth IEEE International Conference on Micro Electro Mechanical Systems, Interlaken, Switzerland, January 21-25, 2001, pp. 98-101
8. Hironari Nakamura, Satoshi Yamamoto, Tatsuo Suemasu, Takashi Takizawa and Kenji Kanbara: "Interconnection Through-Holes Filled With Conductive Paste In Silicon Substrates Using Vacuum Printing Method" Proc. of the 16th JIEP